Carrier QuantumLeap™ Solutions for AI Cooling and Lifecycle Innovation to Showcase at DCW London 2026

Carrier is set to attend Data Centre World (DCW) London 2026 (4–5 March) as a Platinum Sponsor, bringing its Carrier QuantumLeap™ solutions to the forefront of the industry’s most critical challenges. Hosting a Panel Discussion, Keynote and Solo Presentation, key Carrier global stakeholders will demonstrate how Carrier’s thermal, integrated management and service solutions address the mounting strain of AI-driven workloads and the urgent demand for energy efficiency. Carrier is part of Carrier Global Corporation (NYSE: CARR), global leader in intelligent climate and energy solutions.

AI Cooling for High Thermal Density Data Centres

As data centres face unprecedented thermal density requirements, Carrier’s presence at DCW London 2026 focuses on a pivotal industry shift. The rapid expansion of AI has created a twofold challenge: managing extreme heat loads while reducing energy consumption. Carrier’s QuantumLeap™ solutions are engineered to help solve this dilemma, offering a pathway to substantial gains in efficiency, rack density and operational security.

Carrier positions its advanced thermal solutions, including liquid cooling and high-efficiency chillers, not merely as options but as obligations for modern infrastructure. These technologies are designed to handle the intense thermal output of next-generation processors and future growth, ensuring stability and performance.

Integrated Management: BAS + DCIM for Energy Efficiency and Uptime

Beyond hardware, Carrier will also showcase its advanced integrated management solution that unifies critical operational systems. By integrating cooling, power and IT infrastructure through Building Automation Systems (BAS) and Data Centre Infrastructure Management (DCIM), Carrier’s full-service approach provides shared insights to help operators reduce energy waste and protect uptime, streamlining management into a single, cohesive ecosystem.

Lifecycle Innovation: Waste Heat Reuse and Grid Participation

Rounding out its QuantumLeap™ solutions, Carrier will demonstrate how its industry commitment extends across the entire lifecycle of a facility, with emphasis on waste heat reuse and active grid participation. By focusing on service and lifecycle management, Carrier reinforces its position that the future of data centre resource consumption can be optimised to contribute to broader sustainability goals.

“Data centres can’t choose between growth, resilience and energy performance — they need all three. At DCW London 2026, we’re showcasing Carrier QuantumLeap™ solutions to help operators simplify decisions, improve efficiency and move towards measurable energy contribution,” says Bertrand Rotagnon, Senior Director Commercial Sales, Product and Data Centers at Carrier Climate Solutions Europe.

Industry leaders and partners are invited to visit Carrier at stand D70 to discuss their QuantumLeap™ solutions with global Carrier stakeholders – many of whom are available for pre-arranged media interviews. Attendees are also encouraged to join Carrier’s Panel Discussion at 12:20 on Wednesday, 4th March, Solo Presentation at 15:55, and Keynote at 14:50 on Thursday, 5th March, to explore lifecycle solutions in AI data centres, overcoming the thermal wall with legacy cooling and a new approach to data centre sustainability and energy.

For more information on Carrier QuantumLeap™ solutions for data centres, please visit CarrierDCW2026

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